Huanga hua |
|
|
|
|
Tau Wae |
XCZU3EG-2SFVC784E |
XCZU3EG-1SFVC784I |
XCZU3EG-1SFVC784E |
XCZU3EG-2SFVA625E |
Kaihanga |
AMD |
AMD |
AMD |
AMD |
Pūhera |
Tray |
Tray |
Tray |
Tray |
Raupapa |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Rahi Flash |
- |
- |
- |
- |
Pūrere Pūrere Whakarato |
784-FCBGA (23x23) |
784-FCBGA (23x23) |
784-FCBGA (23x23) |
625-FCBGA (21x21) |
Whakaahuatanga |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Tau o I / O |
252 |
252 |
252 |
180 |
Te tukatuka Core |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Tae Mahi |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
Tau hua hua |
XCZU3 |
XCZU3 |
XCZU3 |
XCZU3 |
Nga Papahanga Reo |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
Rahi RAM |
256KB |
256KB |
256KB |
256KB |
Ngā Āhuatanga Tuatahi |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 154K+ Logic Cells |
Paa / Case |
784-BFBGA, FCBGA |
784-BFBGA, FCBGA |
784-BFBGA, FCBGA |
625-BFBGA, FCBGA |
Hononga |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Tere |
533MHz, 600MHz, 1.3GHz |
500MHz, 600MHz, 1.2GHz |
500MHz, 600MHz, 1.2GHz |
533MHz, 600MHz, 1.3GHz |