Huanga hua |
|
|
|
|
Tau Wae |
XCZU4EG-L1SFVC784I |
XCZU4EG-2SFVC784E |
XCZU4EG-2FBVB900I |
XCZU4EV-2SFVC784E |
Kaihanga |
AMD |
AMD |
AMD |
AMD |
Tau hua hua |
XCZU4 |
XCZU4 |
XCZU4 |
XCZU4 |
Paa / Case |
784-BFBGA, FCBGA |
784-BFBGA, FCBGA |
900-BBGA, FCBGA |
784-BFBGA, FCBGA |
Pūrere Pūrere Whakarato |
784-FCBGA (23x23) |
784-FCBGA (23x23) |
900-FCBGA (31x31) |
784-FCBGA (23x23) |
Hononga |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG |
Rahi RAM |
256KB |
256KB |
256KB |
256KB |
Rahi Flash |
- |
- |
- |
- |
Ngā Āhuatanga Tuatahi |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Zynq®UltraScale+™ FPGA, 192K+ Logic Cells |
Tau o I / O |
252 |
252 |
204 |
252 |
Raupapa |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EG |
Zynq® UltraScale+™ MPSoC EV |
Pūhera |
Tray |
Tray |
Tray |
Tray |
Whakaahuatanga |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
MCU, FPGA |
Tere |
500MHz, 600MHz, 1.2GHz |
533MHz, 600MHz, 1.3GHz |
533MHz, 600MHz, 1.3GHz |
533MHz, 600MHz, 1.3GHz |
Tae Mahi |
-40°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
-40°C ~ 100°C (TJ) |
0°C ~ 100°C (TJ) |
Nga Papahanga Reo |
DMA, WDT |
DMA, WDT |
DMA, WDT |
DMA, WDT |
Te tukatuka Core |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 |